AUSTIN, Texas--(BUSINESS WIRE)--Aug. 24, 2004--Molecular Imprints, Inc. ("MII"), the leading manufacturer of step and flash imprint lithography (S-FIL(TM)), has reached an investment agreement with Tokyo Electron Limited (TEL). TEL is one of the world's leading suppliers of semiconductor and flat panel display production equipment. TEL has agreed to make an equity investment in MII as a contributor to MII's Series B funding round. TEL joins KLA-Tencor, Carl Zeiss SMT, Motorola and others as a strategic investor in Molecular Imprints.

"Molecular Imprints is very excited about the strategic investment that it has established with TEL," says Dr. Norman Schumaker, president and CEO of MII. "TEL's lineup of leading-edge systems covers most stages of the semiconductor wafer production process, and its strength in the world market makes TEL an ideal partner."

"TEL is investing in Molecular Imprints in accordance with our policy of accelerating innovations in semiconductors and nanotechnology," said Ken Sato, president and CEO of TEL. "Molecular Imprints is the leadership company pioneering imprint lithography, so this is an excellent opportunity for TEL to be more closely attuned to emerging nanotechnology developments."

Molecular Imprints is currently selling its nanolithography systems to a broad range of markets, including semiconductor devices, displays, photonics structures, and data storage. The company's Imprio(TM) product family is a cost-effective substitute for next generation lithography systems, at a fraction of the price.

About Molecular Imprints, Inc.

Molecular Imprints, Inc. (MII) develops and manufactures nano-lithography systems for high resolution and 3-dimensional pattern replication. The company's unique Step and Flash Imprint Lithography technology is a simple step and repeat, room temperature, low pressure, nano-imprint process that has demonstrated sub-20 nanometer resolution. MII provides enabling lithography systems and technology for manufacturing applications in the areas of: nano-devices, micro structures, advanced packaging, bio-devices, optical components and semiconducting devices.