SAN JOSE, Calif., Sept. 9 /PRNewswire-FirstCall/ -- Ultratech, Inc. (NASDAQ:UTEK) , a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today announced that it has received 300 mm advanced packaging (AP) lithography-system orders from three of Japan's top five semiconductor manufacturers, who will use the Ultratech tools for solder-bump applications. Already the region's leader in gold-bump processing, Ultratech initially penetrated the solder-bump arena in the second half of 2003, shipping Japan's first 300 mm AP lithography system to one of the world's leading merchant foundries. With these orders, Ultratech solidifies its position as a market leader for both gold bump and 300 mm solder-bump lithography in Japan. The 300 mm lithography tools are expected to ship by the end of 2004.

"This year, the growth rate for the solder-bump market is more than 40 percent," explained Jan Vardaman, president and founder of TechSearch International, Inc. "In addition, wafer-level chip-scale packaging (WLCSP) is simultaneously expected to experience double-digit growth in 2004. This concurrent growth is due to the increasing demand for chipsets, as well as wireless and graphics chips that require advanced packaging technology to meet performance and ever-shrinking form-factor design rules. Given these factors, looking forward to 2005, there is a strong anticipated growth in the advanced packaging market."

Driven by the increased demand for consumer electronic devices, Japan has now embraced 300 mm solder-bump lithography production, with key industry leaders choosing to deploy Ultratech tools. "As a leader in advanced packaging technology, we are well positioned to take advantage of the strong growth in Japan's production of advanced semiconductor devices on 300 mm wafers," noted Arthur W. Zafiropoulo, Ultratech chairman and CEO. "Ultratech has strengthened its position in the Japanese market -- as a leader in gold- bump processing, and in 300 mm solder-bump lithography as well. We greatly value our relationships with these top-tier customers and look forward to providing advanced lithography systems designed to deliver superior flexibility, extendibility and cost performance for their advanced packaging applications."

About Ultratech: Ultratech, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices, and has pioneered laser-processing technology for IC manufacturing. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography. Its products are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com.

Source: Ultratech, Inc.
CONTACT: Bruce R. Wright, Senior Vice President & CFO, or Laura
Rebouche, Vice President, Investor Relations and Corporate Communications,
+1-408-321-8835, or fax, +1-408-577-3379, or lrebouche@ultratech.com, both of
Ultratech, Inc.; or Angie Kellen of MCA, +1-650-968-8900, or fax,
+1-650-968-8990, or akellen@mcapr.com, for Ultratech, Inc.
Web site: http://www.ultratech.com/