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TEMPE,
Ariz – Feb. 15, 2005 – Expanding its presence in the
U.S. and Arizona, EV Group has formally opened its
new North American headquarters in Tempe, Ariz., with
a state-of-the-art Class 10 production cleanroom.
The new facility, designed to serve the company’s
expanding North American customer base, will be used
by EV Group for sales and support of its diverse line
of tools for producing electronic devices, such as
semiconductors and flat-panel displays (FPDs), and
for development of nanotechnology production techniques.
EV Group, a leading
manufacturer of MEMS, nano and semiconductor wafer-processing
equipment, also will use the facility to conduct joint
development work with the Flexible Display Center
(FDC), sponsored by Arizona State University (ASU)
and the U.S. Army. EV Group is providing a large-area
spray coater and developer to the center’s GenII automated
production line, which uses 14x18-inch glass substrates.
An EVG850 Laminator and Temporary Bonder, and an EVG850
Debonder also will be installed on the FDC’s 6-inch
process line. EV Group will work closely with all
other partners to develop thin and flexible computer
screens for both military and commercial applications.
Dr. Peter Podesser,
chief executive officer of EV Group, noted that the
Tempe facility will be EV Group’s largest installation
outside of the company’s worldwide headquarters in
Schärding, Austria. “This new headquarters serves
the dual purposes of expanding service to our growing
North American customer base, and collaborating with
Arizona State University and the U.S. Army on a project
with far-reaching implications for the U.S. military
and global commercial markets. We are honored to participate
in programs like the FDC, where our know-how can help
solve some of the greatest technical challenges of
the day, and where we can expand our work with some
of the best minds in the global display industry.”
The FDC, the result
of a $43.7 million cooperative agreement between the
U.S. Army Research Laboratory and ASU, is working
on developing flexible computer screens that can be
integrated as part of a soldier’s uniform, or rolled
up and carried in a soldier’s pocket. The agreement
has a performance period of five years with an option
for an additional $50 million over an added five-year
period, according to the U.S. Army News Service.
“The FDC brings together
academia, industry and government to develop what,
in essence, will be revolutionary information portals
– devices that are small, lightweight, rugged and
consume very little power, but they will be very powerful
in that they will hold the key to successful military
operations – real-time information,” said ASU President
Michael Crow.
Dr. Gregory Raupp,
the FDC’s director, said the technology ultimately
will be developed commercially. “The FDC is a unique
partnership vehicle that enables us to work with best-in-class
form industry, government labs and academia to advance
component technologies, integrate them into working
flexible display technology demonstrators, and in
parallel develop the manufacturing processes and toolsets
to fabricate these revolutionary displays. In this
regard we are thrilled to be able to work with EVG
side-by-side in our facility to leverage their core
capability and expertise in temporary bonding / debonding
and large area coating” he said.
EV Group’s North American
headquarters will be equipped to provide coating,
developing, wafer bonding, nano-imprint lithography
(NIL), mask aligning, and other technologies. All
processes can run up to 150mm wafer sizes, and coating
is available for 200mm wafers. Partner Sonix Inc.
will install a scanning acoustic microscope (SAM),
for use in wafer bonding analysis. The address of
EV Group’s new facility within the Flexible Display
Center is 7700 South River Parkway, Tempe, AZ 85028.
About EV Group
Founded in 1980, EV Group is a global supplier of
wafer bonders, aligners, photoresist coaters, cleaners
and inspection systems for semiconductor, MEMS and
emerging nanotechnology markets. EV Group holds the
dominant share of the market for wafer bonding equipment
(especially SOI bonding) and is a leader in lithography
for advanced packaging, MEMS and nanotechnology. The
company’s unique Triple I approach (Invent – Innovate
– Implement) is supported by a vertical infrastructure,
allowing EV Group to respond quickly to new technology
development, apply the technology to manufacturing
challenges and expedite volume production. Headquartered
in Schärding, Austria, EV Group operates via
a global customer support network, with subsidiaries
in Tempe, Arizona; Albany, New York; Yokohama and
Fukuoka, Japan; and Chung-Li, Taiwan. For more information,
visit www.EVGroup.com <http://www.evgroup.com/>
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