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Fujitsu
Develops World's First Technologies Enabling Formation
and Multi-layering of High Dielectric Constant Ceramic
Film on Resin Circuit Boards
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Tokyo,
Japan, (JCN Newswire) - Fujitsu Limited (TSE: 6702)
and Fujitsu Laboratories Ltd., in collaboration with
the National Institute of Advanced Industrial Science
and Technology (AIST) of Japan, have announced that
they have jointly developed the world's first technologies
that enable the formation and multi-layering at room
temperature of ceramic film with dielectric constant
(*1) of 400, on resin circuit boards. The new technologies
makes it possible to embed passive components such as
condensers into printed circuit boards, such as FR4
(*2), thereby achieving miniaturization and cost reductions
of circuit boards.
The technologies were developed as part of basic research
to realize further miniaturization of devices for the
ubiquitous networking era, by integrating resin with
ceramic materials. Details of the new technology will
be presented at the International Conference on Crystal
Growth (ICCG) to be held from August 9 in Grenoble,
France.
Research for the new technology was commissioned by
the New Energy and Industrial Technology Development
Organization (NEDO), as part of the Nano Structure Forming
for Advanced Ceramic Integration Technology Project,
a nano-technology program of Japan's Ministry of Economy,
Trade, and Industry.
In ubiquitous networking, multi-functionality, miniaturization,
high-speed transmissions, and cost reduction of electronic
devices are considered to be key and necessary factors.
To meet these needs, currently there is much interest
in technology for high-density mounting. For example,
multi-functions such as GPS and wireless LAN are increasingly
being included in mobile devices, resulting in larger
circuit boards. To achieve miniaturization of these
devices, it is necessary to reduce and integrate various
high-frequency components, such as ceramic chip condensers,
on the surface of circuit boards.
Embedding ceramic condensers with high dielectric constant
into printed circuit boards made mainly with low-cost
epoxy resin, widely used in the market now, enables
further multi-functionality, miniaturization, and cost
reduction of electronic devices.
Since the endurance temperature of epoxy-based resin
circuit boards is approximately 300 degrees Celsius,
it was fundamentally impossible in the past to embed
ceramic condensers that require high temperatures for
formation, into circuit boards. Another method exists
in which a composite material consisting of ceramic
dispersed into resin is used. However, as the dielectric
constant of this method is low at only several ten,
this method was unable to meet performance requirements
for high frequencies.
Technology in which the circuit board itself is created
with ceramics requires high temperatures of approximately
1000 degrees Celsius, thus necessitating complicated
processes and making cost reductions difficult. Furthermore,
volume shrinkage of over 10 percent which occurs during
the manufacturing process hinders achieving accurate
dimension, resulting in inabilities to fulfil miniaturization
demands.
Fujitsu and the National Institute of Advanced Industrial
Science and Technology (AIST) of Japan jointly developed
two new technologies: a technology that forms at low
temperatures ceramic film with high dielectric constant
on resin circuit boards, and a technology that enables
multi-layering of condenser structures. Features of
these new technologies are follows:
1. Technology to create ceramic film on resin circuit
boards at low temperatures
This technology enables the creation of ceramic film
on resin circuit boards at room temperature, by utilizing
the aerosol deposition method. In the aerosol deposition
method, gas flow is used to carry ceramic powder, which
is sprayed at high speeds onto circuit boards, thereby
creating a ceramic film resulting from the impact. By
utilizing ceramic particles that feature chemically
unstable surface characteristics, ceramic film was successfully
created at room temperature on resin circuit boards
which ceramic is usually difficult to adhere to. This
technology was jointly developed with Dr. Jun Akedo
and his group at the Advanced Manufacturing Research
Institute of the National Institute of Advanced Industrial
Science and Technology of Japan, the same group that
developed the aerosol deposition method.
2. Technology to enable high dielectric constant and
multi-layering of ceramic film
High dielectric constant was achieved by mixing in highly
crystalline ceramic particles, and controlling the nano-structure
of the ceramic to be formed by optimizing the flow speed
of the ceramic particles. A multi-layer condenser was
successfully created on a resin circuit board by relaxing
internal stress (*3) within the ceramic film that was
created, and by selecting an electrode that is composed
of metal and easily adheres to ceramic film.
By utilizing the new technologies, the world's first
ceramic film formed at room temperature on an FR4 printed
circuit board was successfully created (Figures 1 and
2). The maximum dielectric constant of the newly created
ceramic film was 400, ten times the dielectric constant
of ceramic combined with resin, and is approximately
at the same level as that of ceramic film made with
the sputtering method that employs heat-treating at
the high temperature of 600 degrees Celsius. A condenser
composed of three layers was also successfully created
on an FR4 printed circuit board. The capacitance density
(*4) of the newly created condenser achieved 300 nano-farad/cm2,
a high level that is ideal for practical use.
The new technologies contribute significantly to further
multi-functionality, miniaturization, high-speed transmission,
and cost reduction of various products for the ubiquitous
networking era. Potential product applications include:
- Printed circuit boards and packaging with embedded
condensers
- Modules integrating various ceramic microwave components
(filters, antennas, etc.)
- Microwave electronic components
In addition to developing creation of ceramic dielectric
at low temperatures to target higher dielectric constant,
Fujitsu will promote research and development of ceramic
film that has characteristics ideal for a variety of
device applications, and continue development to aim
for the practical use of condensers embedded in printed
circuit boards.
[Glossary and Notes]
*1. Dielectric constant: An index representing the degree
to which substances can store electric charge. The higher
the value is the moreelectric charge can be stored,
thereby indicating that a substance is superior as a
condenser material.
*2. FR4: Flame Retardant Type 4. The name of a flame
retardant printed circuit board composed compositely
of glass fibers and epoxy resin.
*3. Internal stress: Stress buildup within a material
resulting from strain due to mechanical or thermal factors.
*4. Capacitance density: A value expressing the stored
electrical charge within unit areas of components such
as condensers. The higher this value is the more efficiently
electric charge can be stored.
About Fujitsu Limited
Fujitsu is a leading provider of customer-focused IT
and communications solutions for the global marketplace.
Pace-setting technologies, highly reliable computing
and communications platforms, and a worldwide corps
of systems and services experts uniquely position Fujitsu
to deliver comprehensive solutions that open up infinite
possibilities for its customers' success. Headquartered
in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated
revenues of 4.7 trillion yen (US$45 billion) for the
fiscal year ended March 31, 2004.
About Fujitsu Laboratories Ltd.
Founded in 1968 as wholly owned subsidiary of Fujitsu
Limited, Fujitsu Laboratories Limited is one of the
premier research centers in the world. With a global
network of laboratories in Japan, China, the United
States and Europe, the organization conducts a wide
range of basic and applied research in the areas of
Multimedia, Personal Systems, Networks, Peripherals,
Advanced Materials and Electronic Devices.
About AIST
National Institute of Advanced Industrial Science and
Technology (the new AIST) began operations on April
1, 2001. The AIST is a newborn research organization
that comprises 15 research institutes previously under
the former Agency of Industrial Science and Technology
(the former AIST) in the Ministry of International Trade
and Industry (Table 1 below) and the Weights and Measures
Training Institute. The new AIST is Japan's largest
public research organization with many research facilities
and around 3,200 employees in all.
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This
story has been adapted from a news release -
Diese Meldung basiert auf einer Pressemitteilung -
Deze
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