Francois J. Henley, President and CEO of Silicon Genesis, said, "We are very excited about our new global uniaxial strain technology. This new material offers the potential for significant mobility enhancements over SiGe-based biaxial strain wafer technologies and is compatible with local straining approaches since the strains are additive. It also features very low defect levels due to SiGen's use of its proprietary low-temperature processing technology. It can be directly integrated on silicon as an "epi-like" strained bulk wafer or on an insulator as a strained silicon-on-insulator wafer (s-SOI). The incremental production costs are expected to be significantly lower than biaxial technologies because it avoids the costly steps of growing and relaxing thick silicon-germanium layers."

Dr. Scott Thompson, Associate Professor of the University of Florida's Department of Electrical and Computer Engineering and former Intel Fellow Director of Intel's 90nm Logic Technology and Strained Silicon Program, commented, "Uniaxial strain is now being recognized as the preferred strain type for deep-submicron device applications, and its local variant has displaced global biaxial strain as the mobility enhancer of choice. Biaxial strain has been plagued with process integration issues such as high defect levels and germanium interdiffusion, but more importantly is much less efficient in boosting PMOS transistor performance. Local uniaxial strain processes are already enhancing 90nm performance at many companies. The availability of a global uniaxially strained substrate can work with these existing approaches to substantially improve total transistor performance and has scaling advantages over local strain at the 45nm node and beyond. I look forward to the introduction and use of this new technology."

In line with SiGen's new IP business model strategy, the company is actively pursuing the development and commercialization of NGS with a number of partners. The company believes there will be significant interest in the NGS technology and that this wafer-level uniaxial strained material will have the potential to become the strained silicon substrate of choice.

About Silicon Genesis

Founded in 1997, Silicon Genesis Corporation (SiGen) is a leading provider of Silicon-On-Insulator (SOI) process technology targeted for use in the production of engineered wafers that enable NanoTechnology applications with next generation products. Headquartered in San Jose, California (Silicon Valley), the Company's proprietary NanoCleave(TM)(Layer-transfer), NanoBond(TM) (Plasma-activated bonding), and NanoSmooth(TM)(Epi Smoothing/Epi Thickening) process steps have allowed SiGen to become a leading provider of innovative substrates through its process licensing. SiGen promotes its layer-transfer and engineered wafer technologies by continued development of its advanced process and equipment technologies as well as through strategic alliances. For more information on Silicon Genesis, visit http://www.sigen.com.