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SAN
JOSE, Calif., Oct. 7 /PRNewswire-FirstCall/ -- KLA-Tencor
(NASDAQ:KLAC) and IMEC, Europe's leading independent
nanoelectronics and nanotechnology research center
based in Belgium, have announced that they have entered
into a joint-development project (JDP) to accelerate
the adoption of optical critical dimension (CD) metrology
technology for next-generation (65-nm and below) semiconductor
applications. The JDP will focus on two key areas:
extending the use of optical CD metrology in current
applications, such as shallow trench isolation (STI)
and gate, to the sub-65-nm node; and expanding the
proliferation of optical CD metrology into new applications,
such as 3-D contact and via layers.
KLA-Tencor's SpectraCD 100 system
will be the optical CD metrology tool used by IMEC
for these development efforts. Formally introduced
this past February, SpectraCD 100 has already been
adopted by leading logic and memory manufacturers,
as well as lithography tool suppliers, worldwide.
"Maintaining control over the lithography process
continues to remain one of the most pressing challenges
that chipmakers face as they drive deeper into the
Nano Realm," stated Dr. Luc Van den hove, vice
president of IMEC. "Optical CD metrology has
demonstrated its viability in 90-nm production for
controlling critical patterning steps, and we are
continuing our very effective partnership with KLA-Tencor
to further develop this technology due to the company's
aggressive investment in this technology. We believe
that by working together, we can speed the implementation
of optical CD metrology as a mainstream solution for
managing lithography yields at the 65-nm node and
beyond."
For advanced lithography processes, traditional CD
linewidth measurements are no longer enough to provide
all the information that chipmakers need to accurately
predict and maximize yield and transistor performance.
Complete feature profile information is now required,
including CD, sidewall angle, height and depth. Optical
CD metrology is ideally suited to address this need
due to its full 3-D profile measurement capability,
and it is increasingly being adopted as an in-line
process monitor for 90-nm IC production owing to its
high throughput and ability to collect measurement
data non-destructively compared to other metrology
techniques. However, the transition to 65-nm and smaller
design rules creates an entirely new set of challenges
for lithography process control. Ultra-high numerical
aperture (NA) lithography tools and immersion lithography,
both of which are expected to be introduced in production
at the 65-nm node and below, will further reduce the
size of lithography process windows-accelerating the
need for tighter lithography control in production.
"Optical CD metrology plays an increasingly critical
role in the IC fab in ensuring that patterning processes
are controlled during production, and KLA-Tencor is
committed to further enhancing the applications for
this technology so that our customers can continue
to meet their roadmap requirements," stated David
Fisher, optical CD business unit manager at KLA-Tencor.
"We believe that the combination of IMEC's world-leading
processing capabilities with our optical CD metrology
expertise will yield new insights into advanced lithography
that will help ease our customers' transition to future
technology nodes. IMEC is a leading pioneer in the
development of advanced semiconductor processes, and
we're honored to be chosen by them for this JDP in
advanced lithography control."
SpectraCD 100 utilizes KLA-Tencor's sixth-generation
broadband spectroscopic ellipsometry technology with
reflective optics. The tool provides industry-leading
sensitivity for detecting key process issues, such
as resist footers in gate structures. Its unique 3-D
modeling capability enables contact hole metrology,
which is especially crucial for production monitoring,
since contact hole sizes that are significantly reduced
or closed at the bottom of front-end-of-line (FEOL)
structures can result in significant yield loss. The
3-D modeling capability also provides more accurate
information on sidewall angle and height, which enables
users to achieve tighter process control and better
prediction of electrical performance.
About IMEC: IMEC is a world leading independent research
center in nanoelectronics and nanotechnology. Its
research focuses on the next-generation of chips and
systems, and on the enabling technologies for ambient
intelligence. IMEC's research bridges the gap between
fundamental research at universities and technology
development in industry. Its unique balance of processing
and system know-how, intellectual property portfolio,
state-of-the-art infrastructure and a strong network
of companies, universities and research institutes
worldwide, positions IMEC as a key partner with which
to develop and improve technologies for future systems.
IMEC is headquartered in Leuven, Belgium and has representatives
in the U.S., China and Japan. Its staff of more than
1,300 people includes over 380 industrial residents
and guest researchers. In 2003, its revenues were
EUR 145 million. Further information on IMEC can be
found at www.imec.be
About KLA-Tencor: KLA-Tencor is the world leader in
yield management and process control solutions for
semiconductor manufacturing and related industries.
Headquartered in San Jose, Calif., with operations
around the world, KLA-Tencor ranked #6 on S&P's
2002 index of the top 500 companies in the U.S. KLA-Tencor
is traded on the Nasdaq National Market under the
symbol KLAC. Additional information about the company
is available on the Internet at http://www.kla-tencor.com/
.
Source: KLA-Tencor
CONTACT: Uma Subramaniam,
Director, Product Marketing Communications,
Corporate Communications of KLA-Tencor, +1-408-875-5473,
or
uma.subramaniam@kla-tencor.com; or Katrien Marent,
Corporate Communication
Manager of IMEC, +32 16 281 880, or Katrien.Marent@imec.be;
or David Moreno,
Account Director of MCA, +1-650-968-8900, ext. 125,
or dmoreno@mcapr.com, for
KLA-Tencor
Web site: http://www.imec.be/
Web site: http://www.kla-tencor.com/
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