Device scaling beyond the 90nm technology node drives the need for lower energy implant processing in all areas of the transistor. Axcelis has been developing a new single-wafer platform in anticipation of the industry's growing need for greater productivity and doping precision in high-tilt, low energy implant applications. Axcelis plans to formally unveil the new single-wafer platform in early 2005.

"Being the leader in highly productive low energy implant is the result of our ongoing commitment to technology development and close customer collaborations. This approach, coupled with our market insight, enables us to deliver the most precise and productive tools for our customers," said Mike Luttati, Axcelis' chief operating officer. "The inherent design of our new platform and low energy performance clearly provided AMD with a solution to meet their current and future needs. As devices scale, energy, contamination and angle control play a much larger role, and our platform excels in these areas."

About AMD
AMD (NYSE:AMD) designs and produces innovative microprocessors, Flash memory devices and low-power processor solutions for the computer, communications and consumer electronics industries. AMD is dedicated to delivering standards-based, customer-focused solutions for technology users, ranging from enterprises and governments to individual consumers. For more information, visit www.amd.com .

About Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts and Rockville, Maryland, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com .