Chemists
at New York University have elucidated a mechanism
by which organic molecules attach to semiconductor
surfaces, a finding that has implications for the
semiconductor industry. The industry has sought ways
to exploit the attachment process for a variety of
purposes. The findings, along with a review of the
methodology employed in the study, appear in the
latest issue of the Proceedings of the National Academy
of Sciences and build on studies published by the
same team in the Journal of the American Chemical
Society.
Mark Tuckerman, an associate professor in NYU's
Department of Chemistry and its Courant Institute
of Mathematical Sciences, along with graduate student
Peter Minary and postdoctoral researcher Radu Iftimie,
examined how a butadiene, a particular organic molecule,
binds to a particular silicon surface using first-principles
computer-based models (Iftimie is now an assistant
professor at the University of Montreal, and Minary
is a postdoctoral researcher at Stanford University).
The researchers were able to identify four principal products that a butadiene
can form when binding to the particular silicon surface they studied. These products
had been observed independently in experiments performed elsewhere. More importantly,
the researchers were able to rationalize this product distribution with a unified
mechanistic picture that addresses a long-standing controversy about the reactions
they studied. This mechanism could be used to predict how other organic molecules
will attach to the surface and what products might be expected.
The researchers also explored a process of importance in lithography, or surface
patterning, wherein they examined how an organic molecule comes off a surface.
The process is crucial to the production of computer chips because it requires
superimposing surface patterns multiple times with pinpoint accuracy. Specifically,
they "reverse engineered" an organic molecule using only their computer model
that was found to undergo the reverse reaction--i.e., detachment from the surface--more
easily than the original butadiene used in the attachment studies. This finding
suggests that the reaction chemistry at the semiconductor surface can be controlled
by custom designing or tailoring molecules that exhibit specific desired properties
in the reactions they undergo.
Source: New York University
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[Image
captions: Snapshots (top) and schematic (bottom)
illustrating the products formed by the addition
of an organic molecule (butadiene) to a silicon
surface. Green spheres denote carbon, white spheres
denote hydrogen, blue spheres denote silicon,
grey spheres and blue surfaces denote centers
of high electron density, and red spheres denote
local positive charge. All of the products are
ring structures in which two silicon-carbon bonds
form either on one surface dimer (B left) on
two dimers within a row (C & E left) or
on two dimers across two rows (D left). All reactions
begin asymmetrically with the formation of one
carbon-silicon bond first (A left) with a migration
of positive charge into the organic molecule. The
subsequent location of the positive charge in the
molecule determines where the next carbon-silicon
bond forms, as the progression in the schematic
illustrates.]
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