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SUSS MicroTec Unveils the NPS300: An Innovative NanoPatterning Stepper for Cost Effective Volume Production of Nano-Geometries

SAINT-JEOIRE, France--(BUSINESS WIRE)--April 4, 2005--SUSS MicroTec (FWB:SMH) today announces a next-generation lithography tool which could soon replace traditional optical lithography for the production of nano-scale devices.

The SUSS NPS300 Nano Patterning Stepper was developed within the Sixth Framework Program in cooperation with the VTT Microelectronics Center during a one-year project. In March 2004, a four-year European Commission NaPa project was initiated to develop nano-patterning methods aimed at integrating and standardizing top-down miniaturization and bottom-up self-assembly fabrication approaches. SUSS' partners in the NaPa project are VTT, NMRC-NIL, NMRC-CMG, mrt, EPFL, IBM & LAAS who are all developing complementary cutting-edge technologies including materials, stamps, tools, simulation etc.

The NPS300 is a very flexible tool and is available either as a manually loaded machine or as a fully automated system. The latter configuration includes fully automated wafer handling for sizes up to 300 mm and an automated template pick up capability, allowing different templates to be printed on same wafer. Optimized for the cost-effective replication of micro or nanometer scale devices, the SUSS NPS300 successfully achieves a sub-20 nm imprinting resolution for cold (UV-NIL) and hot embossing applications. When equipped with the automatic alignment option, the NPS300 demonstrates a 250 nm overlay accuracy and accepts stamps with sizes up to 100 mm and thickness' up to 6.5 mm.

"The NPS300 offers various imprinting techniques and is a cost-effective alternative to high-resolution e-beam lithography for printing sub-20 nm geometries." explains Gilbert Lecarpentier, SUSS' Strategic Product Manager for the NPS300 and goes on to explain "Step & Stamp Imprinting for Hot Embossing is an innovative method that has been demonstrated at the VTT Microelectronic Centre in Finland. This method consists of transferring the stamp pattern into a thermoplastic embossing material by controlling heat and pressure. Using in-situ material dispense and UV curing, the Step & Cure Imprinting method can be used for Cold Embossing applications."

By using stamps or templates rather than optical lithography for the imprinting, the NPS300 can replicate the tiniest patterns. Applications include integrated optical devices (passive devices on diodes, gratings, photo refractive polymers, back side illumination devices, etc.), smart materials for microelectronics (sensors, resonators and transducers), sensors for temperature, light, molecules, life science as well as 3-dimensional replication.

Along with this Nano Patterning Stepper, SUSS additionally offers Mask Aligners for Cold Embossing at wafer level, a technique where an imprint resist is cured with UV light, and Substrate Bonders for Hot Embossing using temperature and pressure as curing parameters.

The NPS300 can be seen on our booth #100 in Hall B1 at Semicon Europa from the 12th to the 14th of April.

About VTT

VTT Technical Research Centre of Finland is a contract research organisation involved in many European research programs and other international assignments. With its 2800 employees, VTT provides technology and applied research services for its customers, private companies, institutions and the public sector. VTT also promotes technology transfer by creating public research knowledge and by actively participating in both domestic and international research in electronics, information technology, biotechnology, nanotechnology among others.

Turnover is about 210 million euros. VTT serves annually over 5000 domestic and foreign customers.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, device/flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 800 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange.



Contacts


SUSS MicroTec AG
Brigitte Wehrmann, +49 89 32007 237
B.Wehrmann@suss.de



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