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Tools
of the Trade |
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FEI
Unveils UltraView(TM), the Ultimate Solution for
Ultra-High Resolution Wafer Analysis
New
Process Takes Semiconductor Manufacturers
From Wafers to Atoms In Minutes
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HILLSBORO,
Ore., July 12 /PRNewswire-FirstCall/ -- FEI Company
(Nasdaq: FEIC) introduced UltraView(TM), a state-of-the-art
analysis solution that provides semiconductor manufacturers
with the ability to collect ultra-high resolution analytical
information from wafers, providing process critical
feedback in minutes instead of days. This unique process
drastically reduces the cost of ultra-high resolution
analysis often needed for today's complex devices.
"UltraView represents a highly affordable answer
for today's fabs that are looking to increase yields
and reduce costs associated with complex device designs
that are proceeding well below 90 nm and beyond,"
said Ted Tessner, FEI's director for UltraView solutions.
"With this solution extracted samples, instead
of full wafers, are sent to the lab and atomic-level
resolution data for process diagnostics is sent back
to the fab faster than ever before. As a result, high-throughput
ultra-high resolution analysis is now affordable at
a cost that is comparable with lower resolution analysis
methods."
The UltraView sample analysis process begins in the
fab with FEI's new in-fab Defect Analyzer(TM) 300 HP
equipped with NanoLift(TM). Identified defects are rapidly
milled and transferred to a sealed transfer capsule
via a fully automated process. "Biopsied"
wafers then remain in the process flow as the sample,
in its sealed environment, proceeds to the lab for thinning
and advanced STEM and TEM analysis.
UltraView closes the fab/lab diagnostics loop and provides
manufacturers with added power to increase yields, reduce
costs and speed time to market for new devices. It will
be featured at SEMICON West 2004 in Booth 1316 of the
Moscone Center in San Francisco, July 12-14. More information
on UltraView, the DA 300HP and NanoLift can be found
on FEI 's new website at: http://www.feicompany.com
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About FEI
FEI's Tools for Nanotech(TM), featuring focused ion-
and electron-beam technologies, deliver 3D characterization,
analysis and modification capabilities with resolution
down to the sub-Angstrom level. With R&D centers
in North America and Europe, and sales and service operations
in more the 40 countries around the world, FEI is bringing
the nanoscale within the grasp of leading researchers
and manufacturers and helping to turn some of the biggest
ideas of the this century into reality.
SOURCE FEI Company
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This
story has been adapted from a news release -
Diese Meldung basiert auf einer Pressemitteilung -
Deze
tekst is gebaseerd op een nieuwsbericht - |
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